| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction in size while maintaining mechanical strength of apparatus. SOLUTION: A base material 11 is formed of a metal material and the base material 11 is coupled with insulated substrates 12a to 12c. On the insulated substrates 12a to 12c, semiconductor element group 2a to 2f is mounted via conductors 14a to 14f. On the base material 11, an insulated case 15 is fixed to cover semiconductor element group 2a to 2f. The insulated case 15 holds the input terminals 18a, 18b and output terminals 19a to 19c for electrically connecting the semiconductor element group 2a to 2f and external circuits. This insulated case 16 also works as a fitting base of power supply smoothing capacitor 1. The base material 11 allows loading of a current sensor 3 and a control circuit 4 via the insulated member. |
