APPARATUS FOR AUTO MOLDING LEAD FRAME OF SEMICONDUCTOR

摘要

PURPOSE: An apparatus for automatically fabricating a lead frame is provided to reduce the power required for operating a driving motor by forming the lead frame using a weight of a press. CONSTITUTION: An apparatus for automatically fabricating a lead frame comprises a frame(10) having an upper plate(12) and a lower plate(13) which are spaced by a predetermined distance by a plurality of supporting bars(11). A lower molding plate(21) is mounted on the upper plate(12). A plurality of guide posts(30) are mounted on both sides of the upper plate(12). An upper molding plate(41) is mounted on the guide post(30) in opposition to the lower molding plate(21). A pressing device is mounted on the upper molding plate(41). A moving device is connected to the guide post(30) in order to allow the pressing device to upwardly move.