THERMOCOMPRESSION BONDING WITH RAISED FEATURE

摘要

A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

主权项

1. A bond between a first substrate and a second substrate, comprising:
a first metal layer on the first substrate; a raised feature on the second substrate; and a second metal layer over the second substrate and the raised feature, wherein adhesive bonding strength between the first substrate and the second substrate is in the vicinity of the raised feature as a result of thermocompression bonding between the first metal layer and the second metal layer.