| 主权项 |
1. A method for manufacturing an electronic component including
a first magnetic substrate having a shape of a substantially rectangular parallelepiped which has mutually opposing first and second principal surfaces, the first magnetic substrate having such a shape that a first ridge extending between the first principal surface and the second principal surface is cut away by a first cutout portion; a multilayer body including a plurality of insulator layers stacked on the first principal surface, the multilayer body having a substantially rectangular shape which has a first corner that is arranged so as to overlap the first cutout portion when viewed in plan from a stacking direction in which the plurality of insulator layers are stacked; a first coil provided in the multilayer body, the first coil including a first coil portion and a first lead portion which is connected with one end of the first coil portion and which is drawn out to the first corner; a second coil provided in the multilayer body, the second coil being combined with the first coil to constitute a common mode choke coil, and including a second coil portion magnetically coupled with the first coil portion; a first external electrode provided on the second principal surface; and a first connecting portion configured to connect the first external electrode to the first lead portion, the first connecting portion being provided at the first cutout portion, the first magnetic substrate has such a shape that second through fourth ridges extending between the first principal surface and the second principal surface are cut away by second through fourth cutout portions, respectively, the multilayer body has second through fourth corners that are arranged so as to overlap the second through fourth cutout portions, respectively, when viewed in plan from the stacking direction, the first coil further includes a second lead portion which is connected with the other end of the first coil portion and which is drawn out to the second corner, the second coil further includes third and fourth lead portions configured to be respectively connected with both ends of the second coil portion and to be drawn out to the third and fourth corners, respectively, and the electronic component further includes
second through fourth external electrodes provided on the second principal surface, andsecond through fourth connecting portions configured to connect the second through fourth external electrodes to the second through fourth lead portions, respectively, the second through fourth connecting portions are provided at the second through fourth cutout portions, respectively, a second magnetic substrate configured to be combined with the first magnetic substrate so as to sandwich the multilayer body in the stacking direction, the method comprising the steps of: preparing a mother body in which a mother multilayer body that is a precursor of the multilayer body is interposed between a first mother substrate that is a precursor of the first magnetic substrate and a second mother substrate that is a precursor of the second magnetic substrate; forming through holes at positions in the first mother substrate at which the first through fourth cutout portions are to be formed; forming a conductor layer on an inner perimeter surface of the through holes, thereby forming the first through fourth connecting portions; forming a conductor layer on the second principal surface of the first mother substrate, thereby forming the first through fourth external electrodes; and cutting the mother body. |
