| 摘要 |
A method of making a laminated structure includes forming a first lamination having first and second conductive layers having inner and outer surfaces and being spaced apart by a dielectric layer, drilling through the first conductive layer and dielectric layer to form a blind via having a bottom coexistent with the inner surface of the second conductive layer, plating the blind via with a conductive material, and patterning the second conductive layer to form at least one contact pad over the blind via. |
