Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof

摘要

Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die.

主权项

1. A multi-sensor microelectronic package, comprising:
a singulated accelerometer die comprising:
a first Microelectromechanical Systems (MEMS) transducer structure;a bond pad shelf; anda first row of bond pads on the bond pad shelf; a singulated magnetometer die positioned over the first MEMS transducer structure; a ring of bonding material bonding the singulated magnetometer die to the singulated accelerometer die; and a first hermetically-sealed cavity formed between the singulated magnetometer and the singulated accelerometer die, circumferentially bounded by the ring of bonding material, and enclosing the first MEMS transducer structure.