发明名称 VIA LEAKAGE AND BREAKDOWN TESTING
摘要 Various particular embodiments include a via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure; a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement; a third terminal coupled to a third set of sensing lines in a bottom level of the structure; and a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.
申请公布号 US2016291084(A1) 申请公布日期 2016.10.06
申请号 US201514673185 申请日期 2015.03.30
申请人 GLOBALFOUNDRIES INC. 发明人 Chen Fen;Dufresne Roger A.;Griffin Charles W.;Kolvenbach Kevin W.
分类号 G01R31/28;H01L23/522 主分类号 G01R31/28
代理机构 代理人
主权项 1. A testing structure, comprising: a first three terminal via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure;a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement;a third terminal coupled to a third set of sensing lines in a bottom level of the structure; anda plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.
地址 Grand Cayman KY
您可能感兴趣的专利