Extended heat frame for printed circuit board

摘要

A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.

主权项

1. A circuit board assembly, comprising:
a first mounting frame portion of a first size having a PCB mounted thereto; a second mounting frame portion connected to the first mounting frame portion having no portion of the PCB connected thereto, a combination size of the first and second mounting frames defining a larger second size; a third mounting frame portion connected to the second mounting frame portion and having no portion of the PCB connected thereto, the third mounting frame portion extending longitudinally from the second mounting frame portion; and at least one heat transfer component connected to the first or second mounting frame portion creating a conduction/convection cooling path; wherein the first mounting frame portion includes a first false board edge, and the second mounting frame portion includes at least one false board edge positioned laterally and opposite with respect to the first false board edge.