| 摘要 |
PROBLEM TO BE SOLVED: To highly precisely and efficiently seal an electronic component whose environment resistance is required. SOLUTION: This method uses a carrying tape 10 which is integrally constituted by serially arraying unit region in which a part on which at least the main part of an object to be sealed is placed and an arm part for supporting the placed part are formed by using a low-fusing point resin film to be melted at the melting temperature of resin for molding as materials. Then, this device is provided with a metallic mold for resin molding the placed part, on which the object to be sealed is placed for the whole state entirely that the object to be sealed is placed, each time unit area is fed to a prescribed position. |
