| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which, in the form of a cured product, is excellent in flexibility, soldering-heat resistance, thermal deterioration resistance electroless gold plating resistance, and flame-retardancy and is capable of being developed in an organic solvent or an alkali solution, and is suited for solder resists and interlayer insulation layers. SOLUTION: This composition contains (A) an unsaturation-containing polycarboxylic acid resin being the reaction product among (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an ethylenically unsaturated monocarboxylic acid compound, and (c-1) a polybasic acid anhydride and (B) a urethane oligomer obtained by reacting (d-1) a diol compound represented by the formula (wherein n is 1-15 on the average) with, optionally, (d-2) a polyol compound other than component (d-1), (c-2) a polybasic acid anhydride having at least two acid anhydride groups in the molecule, (e) a polyisocyanate compound, and (f) a hydroxyl-containing (meth)acrylate.
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