| 发明名称 | Semiconductor device and production method therefor | ||
| 摘要 | A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1):; wherein R1 represents an electron-donating group. | ||
| 申请公布号 | US9425120(B2) | 申请公布日期 | 2016.08.23 |
| 申请号 | US201314380455 | 申请日期 | 2013.02.22 |
| 申请人 | HITACHI CHEMICAL COMPANY, LTD | 发明人 | Honda Kazutaka;Nagai Akira;Satou Makoto |
| 分类号 | H01L23/48;H01L23/29;H01L23/31;H01L23/00;C09J11/06;C09J201/00;C08L63/00;C08G59/38;H01L21/56;H01L25/065;B23K35/02;C08K5/09;C09J163/00;C09J163/04 | 主分类号 | H01L23/48 |
| 代理机构 | Fitch, Even, Tabin & Flannery, LLP | 代理人 | Fitch, Even, Tabin & Flannery, LLP |
| 主权项 | 1. A manufacturing method for a semiconductor device, wherein connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising: a step of laminating a film-shaped adhesive for a semiconductor on the semiconductor chip, the adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group; and a step of sealing at least part of the connection portions with a cured product of the adhesive for a semiconductor. | ||
| 地址 | Tokyo JP | ||