发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.
申请公布号 US2016240406(A1) 申请公布日期 2016.08.18
申请号 US201615137347 申请日期 2016.04.25
申请人 CANON ANELVA CORPORATION 发明人 Kajihara Yuji
分类号 H01L21/67;F25B9/00;F25B9/02;H01L43/12;H01L43/02;H01L43/08;H01L43/10;F25B9/14;H05B1/02 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate processing device comprising: a chamber with inside capable of being evacuated; a substrate holder provided inside the chamber and including a substrate mounting surface capable of cooling a substrate; a shield provided inside the chamber and including a side wall portion provided to surround a lateral side of the substrate mounting surface; and shield cooling unit configured to cool the shield before the substrate is mounted on the substrate mounting surface.
地址 Kawasaki-shi JP