发明名称 |
半導体ウェーハのリアルタイム三次元SEM画像化およびビューイングのための装置および方法 |
摘要 |
One embodiment relates to a method of real-time three-dimensional electron beam imaging of a substrate surface. A primary electron beam is scanned over the substrate surface causing electrons to be emitted therefrom. The emitted electrons are simultaneously detection using a plurality of at least two off-axis sensors so as to generate a plurality of image data frames, each image data frame being due to electrons emitted from the substrate surface at a different view angle. The plurality of image data frames are automatically processed to generate a three-dimensional representation of the substrate surface. Multiple views of the three-dimensional representation are then displayed. Other embodiments, aspects and features are also disclosed. |
申请公布号 |
JP6013380(B2) |
申请公布日期 |
2016.10.25 |
申请号 |
JP20130557725 |
申请日期 |
2012.02.13 |
申请人 |
ケーエルエー−テンカー コーポレイション |
发明人 |
チェン チエン−ヒューイ;マクドナルド ポール ディー;クッパ ラジャスカー;多田 拓二;アボット ゴードン;テー チョー;ヤン ヘドン;ラン ステファン;ネイル マーク;サイディン ザイン |
分类号 |
H01J37/28;H01J37/22;H01J37/244 |
主分类号 |
H01J37/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|