| 摘要 |
An exterior lead forming device for semiconductor devices includes a pair of roller holders rotatably attached to a punch plate. When the punch plate is lowered, the leads of a semiconductor device fixedly held on a bending die by a pressing plate are bent along the sides of the bending die. The paths of the bending rollers are monitored by a camera and path errors, calculated by a comparator, are fed back to a motor control circuit to adjust the positions of bending roller guide plates and thereby correct the path errors.
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