| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device which is free from the positional deviation of a lead frame when a semiconductor device positions a bonded lead frame and sets the lead frame on the cavity block of a bottom force of a resin sealing mold. SOLUTION: Vacuum suction holes opened 31 in the first surface of a cavity block 21 with which the second surface of a lead frame 51 is brought into contact, are perforated in the cavity block 21. The lower ends of the vacuum suction holes are connected to vacuum piping through a vacuum line. When set pins 29 implanted in the cavity block 21 are fitted into the positioning holes 59 of the lead frame 51 and set together, the lead frame 51 is vacuum-sucked by the cavity block 21 so that the lead frame 51 is not out of place. |
