| 摘要 |
PROBLEM TO BE SOLVED: To provide an identification method which contributes to more efficient identification of the cause of a defective in a process of manufacturing a semiconductor integrated circuit.SOLUTION: The identification method includes: a first generation process in which first identifiers for identifying a plurality of semiconductor integrated circuits having the same configuration in a wafer state from each other are generated on the basis of each value of input/output signals for a plurality of predetermined internal states of each semiconductor integrated circuit; a management process in which the first identifiers are managed in association with position information indicating the position of the semiconductor integrated circuit on the wafer; a second generation process in which a second identifier for identifying one semiconductor integrated circuit in a separate piece state from another semiconductor integrated circuit in the separate piece state is generated on the basis of each value of the input/output signals for the plurality of predetermined internal states of the one semiconductor integrated circuit; and a specification process in which the second identifier is identified as any of the first identifiers and the position information associated with the identified first identifier is specified. |
