SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a semiconductor package and a manufacturing method of a semiconductor package. For example, the semiconductor package comprises: a lead frame; a semiconductor die electrically connected to the lead frame by means of a first surface; a molding unit formed on the lead frame and surrounding a side portion of the semiconductor die; a first metal plate which covers a second surface of the semiconductor die, which is an opposite surface of the first surface, and an upper surface of the molding unit, and is electrically connected to a ground pad of the semiconductor die; and a ground structure containing a via-hole or a trench which is extended from the first metal plate to penetrate into the molding unit and is electrically connected to a ground connector of the lead frame.