| 摘要 |
The objective of the present invention is to provide a polishing pad which is easy to produce and with which, when mounting the polishing pad to a polishing plate, a release film on an adhesive layer surface provided on the polishing pad can easily be released. This polishing pad is characterized by having at least a polishing layer, an adhesive layer for affixation to a polishing plate, and a release film provided on the adhesive layer surface, wherein a tag member is provided between the adhesive layer and the release film such that one end of said tag member is exposed. |
