发明名称 |
Method for manufacturing conductive adhesive for high frequency flip chip package application |
摘要 |
Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.
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申请公布号 |
US2002111423(A1) |
申请公布日期 |
2002.08.15 |
申请号 |
US20020068878 |
申请日期 |
2002.02.11 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
PAIK KYUNG WOOK;YIM MYUNG JIN;KWON WOON SEONG |
分类号 |
H01L21/52;C08L63/00;C09J7/00;C09J9/02;H01L21/60;H05K3/32;(IPC1-7):H01L21/44;H01L21/48 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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