发明名称 METHOD OF DETACHING A THIN FILM AT MODERATE TEMPERATURE AFTER CO-IMPLANTATION
摘要 A method of detaching a thin film from a source substrate comprises the following steps: . implanting ions or gaseous species in the source substrate so as to form therein a buried zone weakened by the presence of defects; . splitting in the weakened zone leading to the detachment of the thin film from the source substrate. Two species are implanted of which one is adapted to form defects and the other is adapted to occupy those defects, the detachment being made at a temperature lower than that for which detachment could be obtained with solely the dose of the first species.
申请公布号 WO2004042779(A3) 申请公布日期 2004.09.23
申请号 WO2003EP13148 申请日期 2003.10.30
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES;COMMISSARIAT A L'ENERGIE ATOMIQUE;CAYREFOURCQ, IAN;BEN MOHAMED, NADIA;LAGAHE-BLANCHARD, CHRISTELLE;NGUYEN, NGUYET-PHUONG 发明人 CAYREFOURCQ, IAN;BEN MOHAMED, NADIA;LAGAHE-BLANCHARD, CHRISTELLE;NGUYEN, NGUYET-PHUONG
分类号 H01L21/762 主分类号 H01L21/762
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