发明名称 Dual chamber loop heat pipe structure with multiple wick layers
摘要 A loop heat pipe structure includes a transport pipe, an evaporator, a first wick layer, a second wick layer, and a plurality of grooves. The transport pipe communicates with the evaporator. The evaporator has a bottom and internally defines a first chamber and a second chamber, and has a working fluid filled therein. The first wick layer is located on the bottom, and the second wick layer is located on and covers the first wick layer. The grooves can be selectively provided on the first wick layer or the bottom. The first and second wick layers are so designed that the situation of very high vapor pressure would not occur in the second chamber, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.
申请公布号 US9504185(B2) 申请公布日期 2016.11.22
申请号 US201113179567 申请日期 2011.07.11
申请人 Asia Vital Components (Shen Zhen) Co., Ltd. 发明人 Xiang Jun;Zhou Xiao-Xiang;Chiang Kuei-Feng
分类号 F28D15/00;H05K7/20;H01L23/427;F28D15/02;F28D15/04 主分类号 F28D15/00
代理机构 Nikolai & Mersereau, P.A. 代理人 Mersereau C. G.;Nikolai & Mersereau, P.A.
主权项 1. A loop heat pipe structure, comprising: a transport pipe having a first end and a second end, and internally defining a flow passage communicating with the first and the second end; an evaporator having a first chamber and a second chamber adjoining the first chamber, the first chamber and the second chamber having a common bottom comprising a bottom plate, and having a working fluid filled therein; the first chamber having a first coupling hole coupled with the first end of the transport pipe; and the second chamber having a second coupling hole coupled with the second end of the transport pipe; a first wick layer located substantially in the second chamber atop the bottom and extending minimally into the first chamber, the first chamber being generally wick-free; a second wick layer being located atop and covering the first wick layer; wherein the first wick layer has an effective capillary radius smaller and a thermal conductively higher than those of the second wick layer a plurality of grooves being provided under the first wick layer; and wherein the second wick layer does not extend beyond the first wick layer into the first chamber; a partition extending from a top of the evaporator to the second wick layer and separating the first chamber and the second chamber to form two distinct chambers wherein the only direct passage for the working fluid between the second chamber and the adjoining first chamber in the evaporator is through the wick layers; wherein the first coupling hole is an outlet to carry the working fluid away from the evaporator, and the second coupling hole is an inlet for returning the working fluid into the evaporator; and wherein the evaporator includes a cover and said bottom plate correspondingly closed to each other to define the first and the second chamber therebetween; the first and the second wick layer being provided on the bottom plate, and the grooves being selectively provided on any one of the first wick layer and the bottom plate of the evaporator.
地址 Shenzhen CN