Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device

摘要

Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.

主权项

1. A heat radiation printed circuit board, comprising:
a metal substrate including a first area and a second area, wherein the first area and the second area form a continuous structure; and a circuit layer comprising an insulating layer, a circuit pattern, and a solder resist that is formed only on the first area of one surface of a metal substrate; wherein the insulating layer is formed only on the first area of the metal substrate, the circuit pattern is formed on the insulating layer, and a solder resist is applied among the circuit patterns; wherein the circuit layer is separated from the second area; and wherein the metal substrate includes a bending part that connects the first area and the second area, and wherein the bending part includes a groove or a hole.