| 摘要 |
Provided is a method for producing an electronic device with which it is possible to accurately connect an electronic component to a high-density circuit pattern. A solution in which an insulating material and electroconductive nanoparticles having a particle diameter of less than 1 µm are dispersed, or a solution in which electroconductive nanoparticles covered with an insulating material layer are dispersed, is applied in a desired shape onto a surface of a light-transmissive substrate, and a film of the electroconductive nanoparticles covered with the insulating material is formed. An electronic component is mounted on the film. The electroconductive nanoparticles are sintered by light by irradiating the film with light according to a predetermined pattern from the back surface side of the light-transmissive substrate. Thus, a first circuit pattern connected to an electrode of the electronic component is formed, and the first circuit pattern and the electrode of the electronic component are fixed. |
