| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing device and a method which are capable of dealing with wafers corresponding to the properties of a surface protective tape and/or a dicing tape. SOLUTION: The wafer processing method comprises a fixing process of pasting a dicing tape on the rear surface of the wafer where a surface-protective tape is pasted on its front surface so as to fix all the wafer to a frame, an irradiation process of irradiating the dicing tape of the wafer with ultraviolet rays, and a separating process of separating a surface protective tape from the surface of the wafer. The sequence of an irradiating operation carried out by an ultraviolet irradiating unit to irradiate the dicing tape with ultraviolet rays and a separating operation carried out by a separating unit to separate the surface protective tape from the surface of the wafer is determined, on the basis of a relation between the adhesive force of the surface protective tape and that of the dicing tape which has been or has not been irradiated with ultraviolet rays by the ultraviolet irradiating unit. Furthermore, a recognizing unit may be provided which reads and recognizes a recognition mark provided to the wafer and/or the frame. COPYRIGHT: (C)2005,JPO&NCIPI |
