Method for manufacturing electronic device and electronic device

摘要

A method for manufacturing an electronic device, the method includes: applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween; applying a first load to the electronic component while heating the electronic component to a first temperature higher than a reaction start temperature of the adhesive film and lower than a melting point of the bump; reducing the first load to a second load lower than the first load while maintaining the first temperature; and heating the electronic component to a second temperature higher than or equal to the melting point of the bump while maintaining the second load.

主权项

1. A method for manufacturing an electronic device, the method comprising:
applying an adhesive film on a package board; placing an electronic component on the package board with a bump therebetween; applying a first load, using a heat pressing tool, to the electronic component from above the electronic component while heating the electronic component to a first temperature higher than a reaction start temperature of the adhesive film and lower than a melting point of the bump so as to make the bump a horizontally elongated oval shape; reducing the first load to a second load lower than the first load and larger than zero while maintaining the first temperature; and heating the electronic component to a second temperature higher than or equal to the melting point of the bump while maintaining the second load so as to maintain the horizontally elongated oval shape of the bump, wherein the heating of the electronic component to the second temperature starts at substantially the same timing as when the load applied to the electronic component reaches the second load from the first load.