发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in crack resistance and adhesivity. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a hardening agent (B), a filler (C) and a chelating agent component (D). The chelating agent component (D) consists of one or more kinds selected from thiazole chelating agents expressed by formulae (I), (II) and (III).
申请公布号 JP2002275247(A) 申请公布日期 2002.09.25
申请号 JP20010080900 申请日期 2001.03.21
申请人 TORAY IND INC 发明人 SHIMIZU MICHIO;TANAKA AKIKO;HONDA SHIRO
分类号 C08G59/70;C08G59/24;C08G59/40;H01L23/29;H01L23/31;(IPC1-7):C08G59/70 主分类号 C08G59/70
代理机构 代理人
主权项
地址