| 摘要 |
<p>#CMT# #/CMT# The method involves generating a base of a semiconductor material during a process of the formation of an electronic connector unit e.g. through contact (2). The electronic connector unit is arranged on the base of the semiconductor material. An insulated material mound is formed on the base of the semiconductor material by a structuring and/or etching process during the process of the formation of the electronic connector unit, where the insulated material mound represents a semiconductor electrode (3). #CMT# : #/CMT# An independent claim is also included for an encapsulation module for encapsulating a micromechanical structure and/or micromechanical arrangement. #CMT#USE : #/CMT# Method for producing an encapsulation module and/or for encapsulating a micromechanical arrangement, where the encapsulation module is utilized in a motor vehicle control system (claimed). #CMT#ADVANTAGE : #/CMT# The insulated material mound is formed on the base of the semiconductor material by the structuring and/or etching process during the process of the formation of the electronic connector unit, where the insulated material mound represents the semiconductor electrode, thus avoiding the need for metal electrodes, and hence avoiding the high temperature gradient, electric motor forces and the electrical migration and corrosion so that the long-term stability of components of the encapsulation module is improved. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a perspective view of an encapsulation module with a through-contact and a semiconductor electrode in a production condition. A : Encapsulation module 2 : Through contact 3 : Semiconductor electrode 7, 8 : Outer surfaces 9 : Embedding material.</p> |
