System for the heat treatment of substrates, and method for detecting measurement data in said system

摘要

The present invention relates to a device (100) for the heat treatment of substrates and to a method for recording measurement data in said device, where said device (100) comprises at least one heatable chamber (102), a carrier system (108), a sensor assembly (112), and an actuator (111) that is independent of the carrier system (108). The carrier system (108) is designed to carry substrates, whereas the sensor assembly (112) is further configured for coupling to a data recording and/or data storage device (130). The actuator (111) is coupled to the sensor assembly (112) and is configured to position the sensor assembly (112) within the heatable chamber (102).

主权项

1. Device for the heat treatment of substrates, comprising:
at least one heatable chamber that is a continuous furnace, a carrier system being adapted to carry substrates, where said carrier system is formed as a transport system, a sensor assembly configured for coupling to a data recording and/or data storage device, wherein said sensor assembly is disposed on a substrate formed of silicon or material having thermal properties similar to silicon, an actuator that is independent of said carrier system and coupled to said sensor assembly and is configured to move and position said sensor assembly within said heatable chamber; and a control device which is configured for electro-mechanical control of said actuator, so that said sensor assembly can be moved and positioned along at least one predetermined travel path, where said at least one predetermined travel path extends along a direction which is oriented perpendicular to a direction of passage, and perpendicular to a substrate surface of substrates carried by the carrier system.