发明名称 |
Semiconductor device having double side electrode structure and method of producing the same |
摘要 |
A semiconductor device includes a package substrate having a front surface and a backside surface; an electrode pad formed on the front surface; an outer connection pad formed on the backside surface and electrically connected to the electrode pad; a semiconductor chip mounted on the front surface and having an electrode electrically connected to the electrode pad; a sealing resin layer having a through hole formed with a die-molding and reaching the electrode pad for sealing the semiconductor chip; and a through electrode filled in the through hole with a conductive material and having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer.
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申请公布号 |
US8053275(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080219181 |
申请日期 |
2008.07.17 |
申请人 |
OKI SEMICONDUCTOR CO., LTD |
发明人 |
HASEGAWA HIDENORI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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