| 发明名称 |
Temperature measurement and control of wafer support in thermal processing chamber |
| 摘要 |
<p>The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.</p> |
| 申请公布号 |
EP1944793(A2) |
申请公布日期 |
2008.07.16 |
| 申请号 |
EP20080000660 |
申请日期 |
2008.01.15 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HUNTER, AARON MUIR;ADAMS, BRUCE E.;BEHDJAT, MEHRAN;RAMANUJAM, RAJESH S.;RANISH, JOSEPH M. |
| 分类号 |
H01L21/67 |
主分类号 |
H01L21/67 |
| 代理机构 |
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代理人 |
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| 主权项 |
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