发明名称 研削方法
摘要 PROBLEM TO BE SOLVED: To provide a grinding method capable of reducing the risk of protrusion of an adhesive from a support plate and the risk of contaminating a sticking operation region.SOLUTION: A grinding method for thinning a plate-like object to a predetermined thickness comprises the steps of: preparing a support plate having an annular groove at an outer periphery of a surface; sticking the plate-like object to a surface of the support plate prepared by the support plate preparing step via an adhesive by pressing the surface side of the plate-like object; and thinning the plate-like object stuck to the surface of the support plate to a predetermined thickness by griding a rear surface of the plate-like object after performing the plate-like object sticking step. In the plate-like object sticking step, the adhesive driven away to the outer periphery of the plate-like object as a result of pressing the surface side of the plate-like object is captured by the annular groove.
申请公布号 JP5939881(B2) 申请公布日期 2016.06.22
申请号 JP20120105403 申请日期 2012.05.02
申请人 株式会社ディスコ 发明人 久保田 一弘
分类号 H01L21/304 主分类号 H01L21/304
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