| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can manufacture a semiconductor device having a pipe in an integrated manner, without causing leakage of a mold resin into the pipe in an injection step of the mold resin.SOLUTION: A manufacturing method of a semiconductor device having a pipe in an integrated manner comprises the steps of: forming on a lower molding die, an assembly in which an electrode plate, an insulating plate and heat sinks each with insertion parts being formed on an outer periphery are sequentially laminated on each principal surface of semiconductor elements from the semiconductor element side, and in a state where metal pipes each with both ends being broaden are inserted into the insertion parts of the upper heat sink and the insertion parts of the lower heat sink; performing mold clamping by using an upper molding die which contacts whole circumferences of top edges of the metal pipes and the lower molding die which contacts whole circumferences of bottom edges of the metal pipes, to caulk a clearance between the upper molding die and the lower molding die while applying pressure to the metal pipes from above and from the bottom to broaden both ends of each metal pipe; and injecting a mold resin into an internal space formed by the upper molding die and the lower molding die after the mold clamping to cure the mold resin.SELECTED DRAWING: Figure 2F |
