| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyparaphenylene terephthalamide fiber composite having improved adhesiveness to a matrix resin while keeping the high heat resistance and high modulus originally possessed by the polyparaphenylene terephthalamide fiber, and especially useful as an electric/electronic part; and to provide its application. SOLUTION: The polyparaphenylene terephthalamide fiber composite has <50Åcrystal size [(110) face] of the filament, and≥0.1 wt.% and≤10.0 wt.% impregnated proportion of an adhesive. COPYRIGHT: (C)2006,JPO&NCIPI |
