发明名称 MOLDING OFFSET ADJUSTMENT METHOD AND CHARGED PARTICLE BEAM DRAWING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a molding offset adjustment method and a charged particle beam drawing device that accurately grasp a phenomenon and make an adjustment with high precision without changing a way used so far largely.SOLUTION: A molding offset adjustment method includes the steps of: confirming a reference point formed by a first molding aperture overlapping with a second molding aperture, mounted on a charged particle beam drawing device; deflecting a charged particle beam and changing a position of the first molding aperture so that an overlap region of the first molding aperture and the second molding aperture forms a predetermined shot size; measuring a current value of the charged particle beam passing through the overlap region; fitting the relation between the shot size and the corresponding current value using a cubic polynomial, and calculating a coefficient of the cubic polynomial with which the relation can be fitted; and correcting a molding offset amount using the calculated coefficient of the cubic polynomial.
申请公布号 JP2013207135(A) 申请公布日期 2013.10.07
申请号 JP20120075655 申请日期 2012.03.29
申请人 NUFLARE TECHNOLOGY INC 发明人 NAKAYAMA TAKAHITO
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
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