| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing accelerator that is capable of reducing the melt viscosity to increase the liquid flowability of an epoxy resin composition for semiconductor sealing and also capable of increasing the initial hardness during curing to improve mold release properties.SOLUTION: An epoxy resin curing accelerator includes: (A) a quaternary phosphonium compound represented by general formula (1); and (B) a phenolic resin that provides a phenoxide ion as an anion of the quaternary phosphonium compound. In the formula, R1 to R5 each independently represent a hydrogen atom, a linear or branched alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms. |
