| 摘要 |
<p>An annular convex portion (41) is formed along an outer periphery of a back face of a wafer (W) so as to surround a ground area in the back face. The annular convex portion is suction held by a holding table (6) while being brought into close contact with the holding table, and fluid is supplied into a space defined between the back face of the wafer and the holding table; thus, an internal pressure in the space is increased. In this state, a separating adhesive tape (T) is supplied toward a surface of a protective tape (PT), and then a joining roller moves from a first end to a second end of the wafer while pressing a non-adhesive surface of the adhesive tape against the wafer; thus, the adhesive tape is joined to the surface of the protective tape. Then, a guide member (28) moves from the first end to the second end of the wafer to guide the adhesive tape (T) joined to the protective tape (PT) in a reverse direction; thus, the adhesive tape and the protective tape are simultaneously separated from the front face of the wafer.</p> |
