发明名称 Chip bonding method and driving chip of display
摘要 A chip bonding method for bonding a chip on a display panel is provided. The chip includes a joint face, a rear face, input bumps and output bumps. The joint face having a first symmetry axis line is opposite to the rear face. The input bumps and the output bumps are respectively located on two sides of the symmetry axis line and disposed on the joint face. The chip bonding method includes: calculating a first centroid collectively formed by contact faces of the input bumps and the output bumps, defining a straight line passing through the first centroid and parallel to the first symmetry axis line, and applying pressure on the rear face of the chip by a forcing face parallel to the joint face, wherein the forcing face has a second symmetry axis line aligned parallel to the straight line.
申请公布号 US9349702(B2) 申请公布日期 2016.05.24
申请号 US201414557776 申请日期 2014.12.02
申请人 CHUNGHWA PICTURE TUBES, LTD. 发明人 Yang Ching-Ying;Li Yuan-Mo
分类号 H01L23/34;H01L23/00;H01L21/66;H01L23/498 主分类号 H01L23/34
代理机构 McClure, Qualey & Rodack, LLP 代理人 McClure, Qualey & Rodack, LLP
主权项 1. A chip bonding method, provided for bonding a chip to a display panel, the chip comprising a joint face, a rear face, a plurality of input bumps and a plurality of output bumps, the joint face being opposite to the rear face and having a first symmetry axis line, the input bumps disposed on the joint face and located at one of two sides of the first symmetry axis line, the output bumps disposed on the joint face and located at the other side of the first symmetry axis line, the chip bonding method comprising: calculating a first centroid collectively formed by input contact faces of the input bumps; calculating a second centroid collectively formed by output contact faces of the output bumps; defining a straight line parallel to the first symmetry axis line of the joint face to satisfy the relation of D2/D3=Ao/Ai, wherein D2 is the distance from the first centroid to the straight line, D3 is the second centroid to the straight line, Ao is the total area of the output contact faces of the output bumps, Ai is the total area of the input contact faces of the input bumps; and applying pressure on the rear face of the chip via a forcing face, wherein the forcing face is parallel to the joint face and has at least one second symmetry axis line, the at least one second symmetry axis line of the forcing face is aligned parallel to the straight line.
地址 Taoyuan County TW
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