THIN PROFILE PACKAGING WITH EXPOSED DIE ATTACH ADHESIVE

摘要

In an example embodiment, a semiconductor device comprises an underside layer having openings. A carrier has a first side opposite a second side; the first side includes a first conductive layer having a predetermined pattern that defines a number of mutually isolated connection conductors; the second side is in contact with the underside layer and includes contact surfaces corresponding to the connection conductors for placement over a substrate. The openings in the underside layer permit access to the connection conductors. The carrier includes a cavity defined between the first and second sides and exposing a region of the underside layer. An integrated circuit (IC) device including a die area is located in the cavity and is attached to the exposed region of the underside layer, and further includes bonding pads that are wire bonded to the connection conductors. A passivating envelope encapsulates the IC device and extends as far as the carrier; the passivating envelope is mechanically anchored into side faces in the connection conductors.