| 发明名称 |
Bonding clip, carrier and method of manufacturing a bonding clip |
| 摘要 |
Various embodiments provide a clip for clip bonding of a die to a carrier (bonding clip), wherein the clip comprises a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die. |
| 申请公布号 |
US2016172276(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514967271 |
申请日期 |
2015.12.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
AROKIASAMY Xavier;LEONG Sim Fah |
| 分类号 |
H01L23/495;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A clip for clip bonding of a die to a carrier, the clip comprising:
a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die. |
| 地址 |
Neubiberg DE |
