发明名称 |
MANUFACTURING METHOD OF THIN FILM TRANSISTOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin film transistor substrate which can secure the desired TFT performance.SOLUTION: A manufacturing method of a thin film transistor substrate 100 having a thin film transistor includes: a metal layer formation process for forming a gate electrode 120 with Cu as a main component on the upper side of a substrate 110; a first insulation layer formation process for forming a first SiN layer 131 at the deposition temperature equal to or lower than 360°C on the surface of the gate electrode 120; a second insulation layer formation process for forming a second SiN layer 132 at the deposition temperature higher than 360°C on the first SiN layer 131; and a channel layer formation process for forming an oxide semiconductor layer 140 being a channel layer of the thin film transistor on the upper side of the substrate 110.SELECTED DRAWING: Figure 6 |
申请公布号 |
JP2016105444(A) |
申请公布日期 |
2016.06.09 |
申请号 |
JP20140243323 |
申请日期 |
2014.12.01 |
申请人 |
JOLED INC |
发明人 |
MAEDA NORITERU;HARADA TAKESHI |
分类号 |
H01L29/786;H01L21/28;H01L21/318;H01L21/3205;H01L21/336;H01L21/471;H01L21/768;H01L23/532;H01L29/423;H01L29/49;H01L51/50 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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