发明名称 MANUFACTURING METHOD OF THIN FILM TRANSISTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin film transistor substrate which can secure the desired TFT performance.SOLUTION: A manufacturing method of a thin film transistor substrate 100 having a thin film transistor includes: a metal layer formation process for forming a gate electrode 120 with Cu as a main component on the upper side of a substrate 110; a first insulation layer formation process for forming a first SiN layer 131 at the deposition temperature equal to or lower than 360°C on the surface of the gate electrode 120; a second insulation layer formation process for forming a second SiN layer 132 at the deposition temperature higher than 360°C on the first SiN layer 131; and a channel layer formation process for forming an oxide semiconductor layer 140 being a channel layer of the thin film transistor on the upper side of the substrate 110.SELECTED DRAWING: Figure 6
申请公布号 JP2016105444(A) 申请公布日期 2016.06.09
申请号 JP20140243323 申请日期 2014.12.01
申请人 JOLED INC 发明人 MAEDA NORITERU;HARADA TAKESHI
分类号 H01L29/786;H01L21/28;H01L21/318;H01L21/3205;H01L21/336;H01L21/471;H01L21/768;H01L23/532;H01L29/423;H01L29/49;H01L51/50 主分类号 H01L29/786
代理机构 代理人
主权项
地址