APPARATUS FOR CLEANING WAFER BY USING SONIC VIBRATION

摘要

A bit of wafer cleaning equipment is provided to prevent effectively the damage of a wafer edge pattern by restraining acoustic vibration energy from being concentrated on a wafer edge using an improved vibration rod structure. Wafer cleaning equipment includes a vibration rod(210). The vibration rod is installed across a wafer(100) via a water screen. The vibration rod is used for cleaning a surface of the wafer by supplying acoustic vibration energy onto the wafer surface. The vibration rod has a groove(211) corresponding to a wafer edge. The groove has a tilted bottom surface to form a relatively large distance between the vibration rod and the wafer.