| 摘要 |
PURPOSE: A method for manufacturing via holes between layers is provided to equally form the via holes with micro sizes, on a high integrated multi-layer PCB(Printed Circuit Board). CONSTITUTION: A method for manufacturing via holes between layers comprises the steps of: forming an inner layer circuit by a selective corrosion method on a first conducting thin film(51), adhering to an upper/lower part of a first insulating film layer(50); accumulating a second insulating film layer(60) and a second conducting thin film(61) on an upper/lower part of the first conducting thin film(51), on which the inner layer circuit and the first insulating film layer(50) are formed; opening a contact window by corroding the second conducting thin film(61) in the selective corrosion method as the selected size rather than selected via holes, on a location to electrically connect the first conducting thin film(51) and the second conducting thin film(61); forming the via holes with the selected size on the second insulating film(60), exposed by irradiating a laser beam, having a beam spot which has the same size with the via holes, in the opened contact window; and spreading a third conducting film(70) to electrically connect the first conducting film(51) and the second conducting film(61) on the via holes.
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