| 发明名称 |
Plating Method, Electrically Conductive Film And Light-Transmitting Electromagnetic Wave Shielding Film |
| 摘要 |
A plating method comprising: continuously electroplating a film having a surface resistance of 1 to 1,000 ohms per square, wherein a plating solution has a copper content of 150 to 300 g/l as expressed by weight of copper sulfate pentahydrate.
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| 申请公布号 |
US2008096044(A1) |
申请公布日期 |
2008.04.24 |
| 申请号 |
US20060794351 |
申请日期 |
2006.06.02 |
| 申请人 |
MATSUMOTO JUN |
发明人 |
MATSUMOTO JUN |
| 分类号 |
C25D3/38;C25D5/56;G02B1/10;H01B5/14;H01B13/00;H05K9/00 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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