<p>The present invention provides a printed circuit board (PCB) adapted to reduce stress due to coupling of a structure to two different areas of the PCB. The invention involves mechanically isolating an area of the PCB intended for coupling with the structure by forming a stress-relief region around the area in order to create a localised movable area. By introducing such localised flexibility into the PCB in at least the area of one coupling, any build-up of stress due to the coupling of the structure can be mitigated.</p>
申请公布号
WO2008046188(A1)
申请公布日期
2008.04.24
申请号
WO2007CA01773
申请日期
2007.10.10
申请人
TIR TECHNOLOGY LP;PALFREYMAN, PAUL;SCHMEIKAL, LAWRENCE