发明名称 |
Heat Beam Film-Forming Apparatus |
摘要 |
To form a film by generating molecular species which can react at a low temperature, especially, 100° C. or less at which a substrate is not deformed or altered. In a heat beam heating device which instantaneously heats a source gas to a high temperature to cause the source gas to collide with a metal wall including a catalytic function, activated molecular species are generated by a nonequilibrium reaction, sprayed on, and brought into contact with a substrate to form a film. |
申请公布号 |
US2016348239(A1) |
申请公布日期 |
2016.12.01 |
申请号 |
US201514854709 |
申请日期 |
2015.09.15 |
申请人 |
PHILTECH, Inc. |
发明人 |
FURUMURA Yuji;SHIMIZU Noriyoshi;NISHIHARA Shinji |
分类号 |
C23C16/452;C23C16/458;C23C16/40;C23C16/455 |
主分类号 |
C23C16/452 |
代理机构 |
|
代理人 |
|
主权项 |
1. A heat beam film-forming apparatus comprising:
a source gas instantaneously-heating mechanism including a flow path structure which causes a source gas heated to a high temperature to repeatedly collide at a high speed with a metal material containing an element including a catalytic function; and a substrate supported at a temperature lower than a temperature of the source gas instantaneously-heating mechanism, wherein a generated gas generated through the source gas instantaneously-heating mechanism is sprayed and brought into contact with the substrate to form a film. |
地址 |
Tokyo JP |