发明名称 Heat Beam Film-Forming Apparatus
摘要 To form a film by generating molecular species which can react at a low temperature, especially, 100° C. or less at which a substrate is not deformed or altered. In a heat beam heating device which instantaneously heats a source gas to a high temperature to cause the source gas to collide with a metal wall including a catalytic function, activated molecular species are generated by a nonequilibrium reaction, sprayed on, and brought into contact with a substrate to form a film.
申请公布号 US2016348239(A1) 申请公布日期 2016.12.01
申请号 US201514854709 申请日期 2015.09.15
申请人 PHILTECH, Inc. 发明人 FURUMURA Yuji;SHIMIZU Noriyoshi;NISHIHARA Shinji
分类号 C23C16/452;C23C16/458;C23C16/40;C23C16/455 主分类号 C23C16/452
代理机构 代理人
主权项 1. A heat beam film-forming apparatus comprising: a source gas instantaneously-heating mechanism including a flow path structure which causes a source gas heated to a high temperature to repeatedly collide at a high speed with a metal material containing an element including a catalytic function; and a substrate supported at a temperature lower than a temperature of the source gas instantaneously-heating mechanism, wherein a generated gas generated through the source gas instantaneously-heating mechanism is sprayed and brought into contact with the substrate to form a film.
地址 Tokyo JP