| 摘要 |
Disclosed is a semiconductor device capable of reducing a size of a semiconductor chip. According to one embodiment, a semiconductor device includes a core circuit, and a first IO cell and a second IO cell arranged on a periphery of the core circuit. Each of the first IO cell and the second IO cell includes a first power supply terminal to which a power supply voltage is applied; a ground terminal connected to ground; an RC delay circuit including a resistor and a condenser serially connected with each other and having one end connected to the first power supply terminal and the other end connected to the ground terminal; a P-type transistor; and an N-type transistor. In at least one of the first IO cell and the second IO cell, a connection terminal between the resistor and the condenser is connected to a gate of at least one transistor of the P-type transistor and the N-type transistor. When the at least one transistor is the P-type transistor, a source of the P-type transistor is connected to the first power supply terminal, and a drain is connected to the ground terminal. When the at least one transistor is the N-type transistor, a drain of the N-type transistor is connected to the first power supply terminal, and a source is connected to the ground terminal. |
