发明名称 RESIN COMPOSITION FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component, while having a high permittivity, having permittivity isotropy and molding shrinkage isotropy simultaneously, and also to provide a resin composition for producing such the electronic part. SOLUTION: This resin composition for the electronic component comprises a polybutylene terephthalate, spherical strontium titanate having 1 to 2 aspect ratio and glass fibers, and having 48 to 63 vol.% content ratio of the strontium titanate/polybutylene terephthalate, 13 to 18 vol.% content ratio of the glass fiber/strontium titanate and 8 to 10 vol.% content ratio of the glass fiber/polybutylene terephthalate. The electronic component comprising the resin composition is also provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009001678(A) 申请公布日期 2009.01.08
申请号 JP20070164043 申请日期 2007.06.21
申请人 OMRON CORP 发明人 IMAIZUMI TOYOHIRO;HAYASHI HITOSHI
分类号 C08L67/02;C08K3/24;C08K7/14 主分类号 C08L67/02
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