发明名称 APPARATUS AND METHOD FOR HIGH-SPEED FEMTO SECOND LASER MACHINING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method capable of high-speed accurate machining by using a highly repetitive femtosecond laser machine. <P>SOLUTION: Disclosed is the laser machining apparatus which has the femtosecond laser machine, an optical means of guiding femtosecond laser light to a condensing optical system, and a means of moving relative positions of the laser light and a work along a plurality of axes and subjects the surface or the inner part of the work to line or spot machining of≤100μm with a fluence of≤20 J/cm<SP>2</SP>by pulse irradiation of≥10,000 times per second. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005210037(A) 申请公布日期 2005.08.04
申请号 JP20040017721 申请日期 2004.01.26
申请人 CYBER LASER KK 发明人 TAMAKI YUSUKE;SAKUMA JUN;SEKIDA HITOSHI;TAKASAGO KAZUYA
分类号 B23K26/00;B23K26/08;H01S3/00;H01S3/10;H01S3/23;(IPC1-7):H01S3/00 主分类号 B23K26/00
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