| 摘要 |
An LED module sealing technology, which comprises: (1) a waterproof wire (22) that through a hole (21) of a radiator is connected to an anode weld joint and a cathode weld joint on a PCB (12), wherein a through region between the anode weld joint, the cathode weld joint and the waterproof wire (22) is encapsulated by colloid, and a waterproof sealing process is operated between the waterproof wire (22) and the hole (21); (2) fixing the PCB (12) on the radiator (11); (3) placing a solid silica gel ring (14) in a lens group (13) periphery; (4) injecting liquid silica gel (15) along the lens group (13) periphery, and the liquid silica gel dosage is limited to adhering the solid silica gel ring (14) completely; (5) place the radiator (11) which includes the PCB (12) and the waterproof wire (22) upside down on the lens group (13) which is processed by step (4) including the solid silica gel ring (14) and the liquid silica gel (15), and fixing the assembled radiator and the lens group (13). The LED chip is isolated thoroughly by at least dual water proof sealing ring, so that stopping all moisture and any other harmful gas eroding the chip and the PCB, and actualizing the sealing protection between the lens group and the radiator. |
