发明名称 BASE FILM FOR DICING SHEET AND METHOD OF MANUFACTURING BASE FILM
摘要 A base film (2) includes an expandable layer (B) laminated on a cutting-fragment suppression layer (A) and having a laminate structure of a plurality of resin-based sublayers. The resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R1) after 5 minutes of 10%-stretching. The resin-based sublayer (B2) other than the resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R2) after 5 minutes of 10%-stretching. The cutting-fragment suppression layer (A) contains a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).
申请公布号 US2016297180(A1) 申请公布日期 2016.10.13
申请号 US201415037537 申请日期 2014.11.07
申请人 LINTEC CORPORATION 发明人 NAKAMURA Junichi;MIYAZAKI Kentaro;TAYA Naoki
分类号 B32B27/08;B32B27/32;B32B27/30;C09J7/02 主分类号 B32B27/08
代理机构 代理人
主权项 1. A base film of a dicing sheet, the base film comprising a cutting-fragment suppression layer (A) and an expandable layer (B) laminated on one main surface of the cutting-fragment suppression layer (A), the expandable layer (B) having a laminate structure of a plurality of resin-based sublayers, the plurality of resin-based sublayers comprising a resin-based sublayer (B1) that is disposed nearest to the cutting-fragment suppression layer (A) and a resin-based sublayer (B2) that is at least one of other resin-based sublayers than the resin-based sublayer (B1), the resin-based sublayer (B1) having a stress-relaxation rate R1 (unit: %) after 5 minutes of 10%-stretching, the resin-based sublayer (B2) having a stress-relaxation rate R2 (unit: %) after 5 minutes of 10%-stretching, the stress-relaxation rate R1 and the stress-relaxation rate R2 satisfying conditions represented by Expressions (i) to (iii) below, the cutting-fragment suppression layer (A) comprising a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1), wherein R1≦30%  (i)R2≧20%  (ii)R1<R2  (iii).
地址 Itabashi-ku, Tokyo JP